Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501550.pdf?arnumber=9501550
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Low-Temperature Bonding Materials and Insulation Materials for High-Density 3D Packaging;Journal of The Japan Institute of Electronics Packaging;2024-08-01
2. Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at sub-0.5um Pitch;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
4. Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
5. Polymer Hybrid Bonding using Copper Paste and Photosensitive Adhesive for Copper-Copper Bonding at 200-250°C;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
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