Irradiation Hardened p-GaN HEMTs Enabling 558 V Single-Event Hardness at 75.7 MeV⋅cm2/mg and 95% Conversion Efficiency at 300 W/500 kHz
Author:
Affiliation:
1. School of Electronic Science and Engineering, Nanjing University, Nanjing, China
2. CorEnergy Semiconductor Company Ltd., Suzhou, China
Funder
National Key Research and Development Program of China
Jiangsu Provincial Key Research and Development Programme
National Natural Science Foundation of China
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/55/10538033/10495339.pdf?arnumber=10495339
Reference31 articles.
1. Review—Opportunities in Single Event Effects in Radiation-Exposed SiC and GaN Power Electronics
2. Backside Laser Testing of Single-Event Effects in GaN-on-Si Power HEMTs
3. Dose-Rate Dependence of the Total-Ionizing-Dose Response of GaN-Based HEMTs
4. A Comparison of Single-Event Transients in Pristine and Irradiated ${{\rm Al}_{0.3}}{{\rm Ga}_{0.7}}{{\rm N}/{\rm GaN}}$ HEMTs using Two-Photon Absorption and Heavy Ions
5. Heavy ion irradiation induced failure of gallium nitride high electron mobility transistors: effects of in-situ biasing
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Assessing single event upset susceptibility of InAlN HEMT with cap layer under heavy-ion environment;Microsystem Technologies;2024-07-25
2. TCAD Simulation of the Effect of Buffer Layer Parameters on Single Event Burn-Out in p-GaN Gate HEMTs;IEEE Transactions on Electron Devices;2024-07
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