Towards accurate temperature prediction in BEOL for reliability assessment (Invited)-Reference-Cited by-同舟云学术

Towards accurate temperature prediction in BEOL for reliability assessment (Invited)

Published:2023-03 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE International Reliability Physics Symposium (IRPS)
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Author:

Lofrano Melina¹,Oprins Herman¹,Chang Xinyue¹,Vermeersch Bjorn¹,Pedreira Olalla Varela¹,Lesniewska Alicja¹,Cherman Vladimir¹,Ciofi Ivan¹,Croes Kristof¹,Park Seongho¹,Tokei Zsolt¹

Affiliation:

1. imec,Leuven,Belgium,3001

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10117589/10117581/10117701.pdf?arnumber=10117701

Reference22 articles.

1. RC Benefits of Advanced Metallization Options

2. Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters

3. 3ω correction method for eliminating resistance measurement error due to Joule heating

4. The conductivity of thin metallic films according to the electron theory of metals

5. Impact of FEOL cross-heating on the thermal performance of advanced BEOL

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