A Simulation-Based Assessment of Print Accuracy for Microelectronic Parts Manufactured with DLP 3D Printing Process
Author:
Affiliation:
1. Roseggerstraße 12,Polymer Competence Center Leoben GmbH (PCCL),Leoben,Austria,8700
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758869.pdf?arnumber=9758869
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4. Photopolymerization kinetics of an epoxy-based resin for stereolithography
5. UV intensity, temperature and dark-curing effects in cationic photo-polymerization of a cycloaliphatic epoxy resin
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3. Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
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