Prediction model and compensation method for curing shrinkage of inkjet 3D printing parts

Author:

Ping Bu,Huang Jin,Meng Fanbo

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Management Science and Operations Research,Strategy and Management

Reference24 articles.

1. Well-rounded devices: the fabrication of electronics on curved surfaces–a review;Rich;Mater Horiz,2021

2. Developing the nondevelopable: creating curved-surface electronics from nonstretchable devices;Rich;Adv Mater,2022

3. Progress and challenges towards additive manufacturing of SiC ceramic;He;J Adv Ceram,2021

4. Review—inkjet printing of metal structures for electrochemical sensor applications;Sui;J Electrochem Soc,2020

5. Inkjet 3D-printing of functional layers of solid oxide electrochemical reactors: a review;Kawale;React Chem Eng,2022

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