Photopolymerization kinetics of an epoxy-based resin for stereolithography
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference21 articles.
1. Stereolithography and Other RPM Technologies; Society of Manufacturing Engineering: Dearborn, MI, 1996.
2. Kinetic study of the cationic photopolymerization of epoxy monomers
3. Fluorescence Monitoring of Cationic Photopolymerizations: Divinyl Ether Polymerizations Photosensitized by Anthracene Derivatives
4. Photo-differential scanning calorimetry studies of cationic polymerizations of divinyl ethers
Cited by 68 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Recent Developments in Additive Manufacturing Equipment's and Its Processes;Additive Manufacturing with Novel Materials;2024-02-16
2. Epoxy-Based Blend Formulation for Dual Curing in Liquid Crystal Display 3D Printing: A Study on Thermomechanical Properties Variation for Enhanced Printability;Polymers;2024-01-29
3. Polymer-Based Materials: Focus on Sustainability and Recycled Materials for 3D Printing Application;Reference Module in Materials Science and Materials Engineering;2024
4. Biomineralized fluorocanasite‐reinforced biocomposite scaffolds demonstrate expedited osteointegration of critical‐sized bone defects;Journal of Biomedical Materials Research Part B: Applied Biomaterials;2023-11-19
5. Thermomechanical and Electrical Material Characterization for a DLP Printing Process Simulation of Electrically Conductive Parts;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3