Impact of mechanical material modeling on the solder joint fatigue analysis of a leadless package mounted at different positions inside a generic aluminum ECU-Reference-Cited by-同舟云学术

Impact of mechanical material modeling on the solder joint fatigue analysis of a leadless package mounted at different positions inside a generic aluminum ECU

Published:2023-04-17 Issue: Volume: Page:
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Container-title:2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Niessner Martin¹,Gyarmati Attila²,Guettler Herbert²

Affiliation:

1. Infineon Technologies AG,Neubiberg,Germany

2. MicroConsult Engineering GmbH,Bernstadt,Germany

Funder

Ministry of Education

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10100701/10100725/10100779.pdf?arnumber=10100779

Reference17 articles.

1. Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications

2. Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability,2019

3. Stress Recovery in the Reduced Space for Parametric Reduced Models in Microelectronics

4. Thermo-Mechanical Super-Element of a Packaged-Chip Model for Integrating Reduced State-Space Models into Finite Element Analysis Tools;umunnakwe;EuroSimE 2023,2023

5. Delphi Compact thermal model guideline,2008

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2. Predictive Reliability Assessment Workflow for System-Level Reliability of Solder Interconnections;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07

3. Thermo-Mechanical Compact Model to Simulate Solder Fatigue of QFN packages;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07