Thermo-Mechanical Compact Model to Simulate Solder Fatigue of QFN packages
Author:
Affiliation:
1. NXP Semiconductors Gerstweg 2,Nijmegen,Netherlands,6534 AE
Funder
ITEA
Agentschap Innoveren en Ondernemen
Bundesministerium für Bildung und Forschung
Rijksdienst voor Ondernemend Nederland
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491281/10491408/10491413.pdf?arnumber=10491413
Reference17 articles.
1. Reduction of empiricism in the solder joint reliability assessment of QFN packages by using thermo-mechanical simulations
2. Impact of mechanical material modeling on the solder joint fatigue analysis of a leadless package mounted at different positions inside a generic aluminum ECU
3. Approximation of Large-Scale Dynamical Systems
4. Model Order Reduction for Linear and Nonlinear Systems: A System-Theoretic Perspective
5. A Survey of Projection-Based Model Reduction Methods for Parametric Dynamical Systems
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