Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications-Reference-Cited by-同舟云学术

Model Order Reduction of a Thermo-Mechanical Packaged Chip Model for automotive MOSFET applications

Published:2022-04-25 Issue: Volume: Page:
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Container-title:2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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Author:

Umunnakwe C. B.¹,Zawra I.¹,Yuan C.¹,Rudnyi E. B.²,Hohlfeld D.³,Niessner M.⁴,Bechtold T.¹

Affiliation:

1. Jade University of Applied Sciences,Wilhelmshaven,Germany

2. Cadfem GmbH,Munich,Germany

3. University of Rostock,Germany

4. Infineon Technologies AG,Neubiberg,Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9758836/9758837/09758904.pdf?arnumber=9758904

Reference19 articles.

1. Model Order Reduction in Mechanical Engineering;lohmann;Model Order Reduction,2020

2. Model reduction for thermomechanical simulation of packages;zukowski;20th International Workshop on Thermal Investigations of ICs and Systems,2005

3. Reliability of Chip/DCB Solder Joints in AlSiC Base Plate Power Modules: Influence of Chip Size

4. Stress simulation in packages IPC/JEDEC-9301 general guideline; viscoelastic material model calibration, validation and application;niessner;22nd International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems,2021

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