Cu/BCB hybrid bonding with TSV for 3D integration by using fly cutting technology
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7102535/7110993/07111128.pdf?arnumber=7111128
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application;Nanomaterials;2023-09-04
2. A Novel Polymer-Based Ultra-High Density Bonding Interconnection;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. Copper Bonding Technology in Heterogeneous Integration;Electronic Materials Letters;2023-04-19
5. Advanced Cu/Polymer Hybrid Bonding System for Fine‐Pitch 3D Stacking Devices;Advanced Materials Technologies;2023-04-12
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