Surface Roughness Modeling of Substrate Integrated Waveguide in D-Band-Reference-Cited by-同舟云学术

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Surface Roughness Modeling of Substrate Integrated Waveguide in D-Band

Published:2016-04 Issue:4 Volume:64 Page:1209-1216
ISSN:0018-9480
Container-title:IEEE Transactions on Microwave Theory and Techniques
language:
Short-container-title:IEEE Trans. Microwave Theory Techn.

Author:

Yi Ming,Li Sensen,Yu Huan,Khan Wasif,Ulusoy Cagri,Vera-Lopez Aida,Papapolymerou John,Swaminathan Madhavan

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Radiation

Link

http://xplorestaging.ieee.org/ielx7/22/7445805/7426857.pdf?arnumber=7426857

Cited by 31 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wave Impedance Determination for PCB SIWs Considering Metal Roughness Loss Effects;Micromachines;2024-07-04

2. Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits;IEEE Transactions on Electron Devices;2024-07

3. Closed-Form Expressions of Parasitic Parameters for Different Sidewall Roughness of Through-Silicon Vias Interconnects;IEEE Transactions on Electron Devices;2024-02

4. Simplified High-Efficiency Soldering Method for the Fabrication of Devices on Empty Substrate Integrated Waveguides;IEEE Access;2024

5. Analysis and Optimization of Sidewall Roughness on Microwave Performance of Through-Glass Vias in 3-D Integrated Circuits;IEEE Transactions on Microwave Theory and Techniques;2024-01

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