Simplified High-Efficiency Soldering Method for the Fabrication of Devices on Empty Substrate Integrated Waveguides-Reference-Cited by-同舟云学术

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Simplified High-Efficiency Soldering Method for the Fabrication of Devices on Empty Substrate Integrated Waveguides

Published:2024 Issue: Volume:12 Page:61336-61342
ISSN:2169-3536
Container-title:IEEE Access
language:
Short-container-title:IEEE Access

Author:

Fernandez Marcos D.¹^ORCID,Belenguer Angel¹^ORCID,Herraiz Darío¹^ORCID,Martinez Leticia¹^ORCID,Ballesteros José A.¹^ORCID

Affiliation:

1. Escuela Politécnica de Cuenca, Universidad de Castilla-La Mancha, Campus Universitario, Cuenca, Spain

Funder

Ministerio de Ciencia e Innovación, Spanish Government

Funds NextGenerationEU/PRTR

European Plus Social Fund

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/6287639/10380310/10510297.pdf?arnumber=10510297

Reference26 articles.

1. Novel Empty Substrate Integrated Waveguide for High-Performance Microwave Integrated Circuits

2. Empty SIW Technologies: A Major Step Toward Realizing Low-Cost and Low-Loss Microwave Circuits

3. Manufacturing Methods Based on Planar Circuits

4. Design of a Hybrid Directional Coupler in Empty Substrate Integrated Waveguide (ESIW)

5. Cross-guide Moreno directional coupler in empty substrate integrated waveguide

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