Compact thermal modeling of hot spots in advanced 3D-stacked ICs-Reference-Cited by-同舟云学术

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Compact thermal modeling of hot spots in advanced 3D-stacked ICs

Published:2009-12 Issue: Volume: Page:
ISSN:
Container-title:2009 11th Electronics Packaging Technology Conference
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Author:

Torregiani C.,Oprins H.,Vandevelde B.,Beyne E.,De Wolf I.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5398729/5416395/05416563.pdf?arnumber=5416563

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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