Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests-Reference-Cited by-同舟云学术

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Comparison of mechanical response of PCBs subjected to product-level and board-level drop impact tests

Published: Issue: Volume: Page:
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Container-title:Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003)
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Author:

Ong Y.C.,Shim V.P.W.,Chai T.C.,Lim C.T.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8973/28473/01271520.pdf?arnumber=1271520

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Achieving Non-underfill SMT Process for Large Size Packages by Creative Package Pin Map and PCB Pad Designs;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Wearout Reliability-Based Characterization in Memory Packaging;Springer Series in Reliability Engineering;2023

3. Advanced utilization of 3D digital image correlation for thermal and impact reliabilities of electronics components;Microelectronics International;2021-01-29

4. Dynamic response of electronic materials to impact loading: review;ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik;2017-01-12

5. Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact;Journal of Materials Science: Materials in Electronics;2016-05-20

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