Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference28 articles.
1. S. Goyal, E.K. Buratynski, Methods for realistic drop testing. Int. J. Microcircuits Electron. Packag. 23(1), 45–52 (2000)
2. S.K.W. Seah, et al., Mechanical response of PCBs in portable electronic products during drop impact, EPTC, Singapore (2002)
3. Y.C. Ong, et al., Comparison of mechanical response of PCBs subjected to product level and board-level drop impact tests, EPTC (2003)
4. T.Y. Tee, et al., Novel numerical and experimental analysis of dynamic responses under board level drop test, in EuroSime Conference (2004)
5. T.C. Chai, et al., Board level drop test reliability of IC packages, ECTC (2005)
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