Mechanical response of PCBs in portable electronic products during drop impact-Reference-Cited by-同舟云学术

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Mechanical response of PCBs in portable electronic products during drop impact

Published: Issue: Volume: Page:
ISSN:
Container-title:4th Electronics Packaging Technology Conference, 2002.
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Author:

Seah S.K.W.,Lim C.T.,Wong E.H.,Tan V.B.C.,Shim V.P.W.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/8446/26603/01185609.pdf?arnumber=1185609

Cited by 41 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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2. FE analysis of refrigerator drop test and the optimization of lower hinge geometry using equivalent static load method;Journal of Mechanical Science and Technology;2018-11

3. Transferring momentum: Novel drop protection concept for mobile devices;International Journal of Impact Engineering;2018-07

4. Dynamic response of electronic materials to impact loading: review;ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik;2017-01-12

5. Board level drop test: exact solution to the problem of the nonlinear dynamic response of a PCB to the drop impact;Journal of Materials Science: Materials in Electronics;2016-05-20

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