Achieving Non-underfill SMT Process for Large Size Packages by Creative Package Pin Map and PCB Pad Designs
Author:
Affiliation:
1. Huawei Technologies Co., Ltd,Xian City,P.R. China,710077
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492128.pdf?arnumber=10492128
Reference15 articles.
1. Investigating the drop impact of portable electronic products
2. Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact Loading
3. Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics
4. Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods
5. Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model
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