Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging-Reference-Cited by-同舟云学术

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Investigation of the Trace Line Failure Mechanism and Design of Flexible Wafer Level Packaging

Published:2009-05 Issue:2 Volume:32 Page:390-398
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Ming-Chih Yew ,Yuan C.C.A.,Chung-Jung Wu ,Dyi-Chung Hu ,Wen-Kun Yang ,Kuo-Ning Chiang

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/4982886/04912375.pdf?arnumber=4912375

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