Cross-Chamber Data Transferability Evaluation for Fault Detection and Classification in Semiconductor Manufacturing-Reference-Cited by-同舟云学术

Cross-Chamber Data Transferability Evaluation for Fault Detection and Classification in Semiconductor Manufacturing

Published:2023-02 Issue:1 Volume:36 Page:68-77
ISSN:0894-6507
Container-title:IEEE Transactions on Semiconductor Manufacturing
language:
Short-container-title:IEEE Trans. Semicond. Manufact.

Author:

Zhu Feng¹^ORCID,Jia Xiaodong²^ORCID,Li Wenzhe²^ORCID,Xie Min³^ORCID,Li Lishuai⁴^ORCID,Lee Jay²^ORCID

Affiliation:

1. Department of Advanced Design and Systems Engineering, City University of Hong Kong, Pokfulam, Hong Kong

2. Center for Intelligent Maintenance Systems, University of Cincinnati, Cincinnati, OH, USA

3. Department of Advanced Design and Systems Engineering and the School of Data Science, City University of Hong Kong, Pokfulam, Hong Kong

4. School of Data Science, City University of Hong Kong, Pokfulam, Hong Kong

Funder

Research Grants Council (RGC) General Research Fund

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/66/10036056/09953193.pdf?arnumber=9953193

Reference36 articles.

1. A Framework for Semi-Automated Fault Detection Configuration with Automated Feature Extraction and Limits Setting

2. Pattern-based trace segmentation and feature extraction for semiconductor manufacturing and application to fault detection;feng;Proc 30st Annu SEMI Adv Semicond Manuf Conf,2018

3. Semiconductor fault detection and classification for yield enhancement and manufacturing intelligence

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