Signal Integrity Analysis of High Speed Channel considering Thermal Distribution-Reference-Cited by-同舟云学术

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Signal Integrity Analysis of High Speed Channel considering Thermal Distribution

Published:2021-10-17 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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Author:

Son Keeyoung,Kim Seongguk,Kim Minsu,Lho Daehwan,Kim Keunwoo,Park Hyunwook,Park Gapyeol,Kim Joungho

Funder

National Research Foundation of Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9607744/9609110/09609215.pdf?arnumber=9609215

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The Significance of Thermal-Aware Universal Chiplet Interconnect Express (UCIe) Interface Design in 2.5D/3D ICs;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12

2. Thermally Induced Losses on High Speed Interconnects;2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI);2023-07-29

3. Power Distribution Network Impedance Analysis considering Thermal Distribution;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12

4. Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

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