Development of an alternative wire bond test technique-Reference-Cited by-同舟云学术

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Development of an alternative wire bond test technique

Published:1994 Issue:4 Volume:17 Page:610-615
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Pecht M.,Barker D.,Lall P.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/7883/00335048.pdf?arnumber=335048

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. ATNet: A Defect Detection Framework for X-ray Images of DIP Chip Lead Bonding;Micromachines;2023-07-05

2. A data-driven method for enhancing the image-based automatic inspection of IC wire bonding defects;International Journal of Production Research;2020-09-27

3. Study of Complex Looping With Five Kinks in Thermosonic Wire Bonding by Using Variable-Length Link-Spring Model;IEEE Transactions on Components, Packaging and Manufacturing Technology;2019-02

4. Progress in ultrasonic bonding wire process and quality evaluation of bonding point;AOPC 2017: Optical Sensing and Imaging Technology and Applications;2017-10-24

5. Effect of wire diameter and hook location on second bond failure modes;Microelectronics International;2015-01-05

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