Progress in ultrasonic bonding wire process and quality evaluation of bonding point-Reference-Cited by-同舟云学术

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Progress in ultrasonic bonding wire process and quality evaluation of bonding point

Published:2017-10-24 Issue: Volume: Page:
ISSN:
Container-title:AOPC 2017: Optical Sensing and Imaging Technology and Applications
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Author:

Mo Defeng,Wu Jiarong,Jiang Mengdie,Zhang Jinglin,Xu Lin,Zhao Zhenli

Publisher

SPIE

Reference37 articles.

1. Effect of Conduction Pre-heating in Au-Al Thermosonic Wire Bonding

2. Online Quality Evaluation of Ultrasonic Wire Bonding Using Input Electrical Signal of Piezoelectric Transducer;Wu;IEEE Congress on Computer Science & Information Engineering,2009

3. Situation and development trend of equi-pment for wire bonding;He;Electronic Products Marufa-cturing,2004

4. Reliabilty Analysis for Wire Bonding in Micro-system Packaging;Dong;Electronics Process Technology,2015

5. Overview of wire bonding using copper wire or insulated wire

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Application research on the time–frequency analysis method in the quality detection of ultrasonic wire bonding;International Journal of Distributed Sensor Networks;2021-05

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