HeatWatch: Improving 3D NAND Flash Memory Device Reliability by Exploiting Self-Recovery and Temperature Awareness-Reference-Cited by-同舟云学术

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HeatWatch: Improving 3D NAND Flash Memory Device Reliability by Exploiting Self-Recovery and Temperature Awareness

Published:2018-02 Issue: Volume: Page:
ISSN:
Container-title:2018 IEEE International Symposium on High Performance Computer Architecture (HPCA)
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Author:

Luo Yixin,Ghose Saugata,Cai Yu,Haratsch Erich F.,Mutlu Onur

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/8326505/8326983/08327033.pdf?arnumber=8327033

Cited by 86 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Impact of Program–Erase Operation Intervals at Different Temperatures on 3D Charge-Trapping Triple-Level-Cell NAND Flash Memory Reliability;Micromachines;2024-08-23

2. Life-after-Death: Exploring Thermal Annealing Conditions to Enhance 3D NAND SSD Endurance;Proceedings of the 16th ACM Workshop on Hot Topics in Storage and File Systems;2024-07-08

3. MegIS: High-Performance, Energy-Efficient, and Low-Cost Metagenomic Analysis with In-Storage Processing;2024 ACM/IEEE 51st Annual International Symposium on Computer Architecture (ISCA);2024-06-29

4. Improving Block Management in 3D NAND Flash SSDs with Sub-Block First Write Sequencing;Proceedings of the Great Lakes Symposium on VLSI 2024;2024-06-12

5. Achieving Near-Zero Read Retry for 3D NAND Flash Memory;Proceedings of the 29th ACM International Conference on Architectural Support for Programming Languages and Operating Systems, Volume 2;2024-04-27

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