Funder
Institute of Microelectronics
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Biotechnology
Cited by
8 articles.
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1. Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling;2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits);2023-06-11
2. Inverse Design of On-Chip Interconnect via Transfer Learning-Based Deep Neural Networks;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-06
3. Advanced System in Package Enabled by Wafer Level Heterogeneous Integration of Chiplets;2022 International Electron Devices Meeting (IEDM);2022-12-03
4. Wideband Switchable Sharp-Rejection Filter in Compact 3-D Heterogeneous Integration;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09
5. Equivalent Circuit Model of Strip Line up to 110GHz;2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC);2022-09-01