Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components-Reference-Cited by-同舟云学术

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Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components

Published:2023-05-10 Issue: Volume: Page:
ISSN:
Container-title:2023 46th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Hartleb Moritz¹,Imrich Peter¹,Zechner Johannes²,Walter Thomas³,Khatibi Golta³

Affiliation:

1. KAI – Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Technologiepark Villach, Europastraße 8,Villach,Austria,9524

2. Infineon Technologies Austria AG, Siemensstraße 2,Villach,Austria,9500

3. Institute of Chemical Technologies and Analytics CTA, TU Wien, Getreidemarkt 9/164,Vienna,Austria,1060

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168521.pdf?arnumber=10168521

Reference9 articles.

1. Influence of indenter angle on cracking in Si and Ge during nanoindentation

2. Distribution and segregation of arsenic at theSiO2/Si interface

3. Adhesion energy of printed circuit board materials using four-point-bending validated with finite element simulations

4. Cross-sectional nanoindentation: a new technique for thin film interfacial adhesion characterization

5. Polyimides for semiconductor applications

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

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