Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications-Reference-Cited by-同舟云学术

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Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications

Published:2024-05-15 Issue: Volume: Page:1-5
ISSN:
Container-title:2024 47th International Spring Seminar on Electronics Technology (ISSE)
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Author:

Hartleb Moritz¹,Imrich Peter¹,Zechner Johannes²,Walter Thomas³,Khatibi Golta³

Affiliation:

1. KAI – Kompetenzzentrum Automobil- und Industrieelektronik GmbH, Technologiepark Villach,Villach,Austria,9524

2. Infineon Technologies Austria AG,Villach,Austria,9500

3. TU Wien,Institute of Chemical Technologies and Analytics CTA,Vienna,Austria,1060

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10603446/10603455/10603751.pdf?arnumber=10603751

Reference10 articles.

1. Approaches to investigate delamination and interfacial toughness in coated systems: an overview

2. Polyimides for semiconductor applications

3. A Test Specimen for Determining the Fracture Resistance of Bimaterial Interfaces

4. Fracture toughness of an epoxy system

5. Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components

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