Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux
Author:
Affiliation:
1. Institute of Chemical Technologies and Analytics,TU Wien,Vienna,Austria
Funder
Austrian Science Fund
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168365.pdf?arnumber=10168365
Reference12 articles.
1. The influence of Fe2O3 nano-reinforced SAC lead-free solder in the ultra-fine electronics assembly
2. Effects of Metallic Nanoparticles on Interfacial Intermetallic Compounds in Tin-Based Solders for Microelectronic Packaging
3. Three‐dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
4. Effects of Fe2NiO4 nanoparticles addition into lead free Sn–3.0Ag–0.5Cu solder pastes on microstructure and mechanical properties after reflow soldering process
5. Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping
Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*;2023 IEEE Nanotechnology Materials and Devices Conference (NMDC);2023-10-22
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