Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*
Author:
Affiliation:
1. Institute for Chemical Technologies and Analytics, TU Wien, Getreidemarkt 9/164,Vienna,Austria,1060
Funder
Austrian Science Fund
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10343386/10343419/10343630.pdf?arnumber=10343630
Reference12 articles.
1. A study of nanoparticles in Sn–Ag based lead free solders
2. Materials modification of the lead-free solders incorporated with micro/nano-sized particles: A review
3. An Introduction to Signal Detection and Estimation
4. Hybrid solder joints: morphology and shear strength of Sn–3.0Ag–0.5Cu solder joints by adding ceramic nanoparticles through flux doping
5. Influence of Ni nanoparticle on the morphology and growth of interfacial intermetallic compounds between Sn–3.8Ag–0.7Cu lead-free solder and copper substrate
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