Funder
National Science Foundation
Defense Advanced Research Projects Agency
University of California Institute for Mexico and the United States
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Software
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-12
2. Linear Time Electromigration Analysis Based on Physics-Informed Sparse Regression;IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems;2023-11
3. PostPINN-EM: Fast Post-Voiding Electromigration Analysis Using Two-Stage Physics-Informed Neural Networks;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28
4. HierPINN-EM;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30
5. Failure Mechanisms Driven Reliability Models for Power Electronics: A Review;Journal of Electronic Packaging;2022-10-22