Active Shielding of MWCNT Bundle Interconnects: An Efficient Approach to Cancellation of Crosstalk-Induced Functional Failures in Ternary Logic

Author:

Khezeli Maryam RezaeiORCID,Hossein Moaiyeri MohammadORCID,Jalali AliORCID

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics

Cited by 48 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

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3. Implementation of ternary stateful logic based on ternary memristor;Fifth International Conference on Artificial Intelligence and Computer Science (AICS 2023);2023-10-17

4. Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic;e-Prime - Advances in Electrical Engineering, Electronics and Energy;2023-09

5. Polymer Liners with Cu-MWCNT based HCTSVs to Reduce Crosstalk Effects;Russian Microelectronics;2023-08

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