Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing

Published:2019-12 Issue: Volume: Page:
ISSN:
Container-title:2019 IEEE 21st Electronics Packaging Technology Conference (EPTC)
language:
Short-container-title:

Author:

Depiver Joshua A.,Mallik Sabuj,Harmanto Dani,Amalu Emeka H.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9006769/9026560/09026710.pdf?arnumber=9026710

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparative Analysis of SAC Solder Alloys for Enhanced Reliability in Electronic Assemblies: A Finite Element Approach;2024-07-18

2. Effect of Creep, Fatigue and Random Vibration on the Integrity of Solder Joints in BGA Package;Microelectronics Reliability;2024-06

3. Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA);2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

4. High Temperature Storage Simulation and Strain Analysis of Solder Ball in Fan-Out Wafer Level Package (FOWLP);2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

5. The Interplay of Creep Behaviour, Fatigue Failure, and Random Vibration: Implications for Solder Joint Reliability;2023

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP