Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)-Reference-Cited by-同舟云学术

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Assessing the Impact of Creep and Random Vibration on BGA Solder Interconnects Through Finite Element Analysis (FEA)

Published:2024-05-15 Issue: Volume:9 Page:1-6
ISSN:
Container-title:2024 47th International Spring Seminar on Electronics Technology (ISSE)
language:
Short-container-title:

Author:

Depiver Joshua¹,Mallik Sabuj²,Amalu Emeka H.³

Affiliation:

1. University of Derby,School of Engineering,Derby,United Kingdom

2. Buckinghamshire New University,School of Engineering and the Built Environment,High Wycombe,United Kingdom

3. Teesside University,School of Computing, Engineering and Digital Technologies,Middlesbrough,United Kingdom

Funder

University of Derby

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10603446/10603455/10604180.pdf?arnumber=10604180

Reference46 articles.

1. Finite element analysis of the effect of process-induced voids on the fatigue lifetime of a lead-free solder joint under thermal cycling

2. Lead-Free Solders: Focus on Fundamentals, Reliability, and Applications

3. Advances in lead-free electronics soldering

4. Finite element analysis on the effect of solder joint geometry for the reliability of ball grid array assembly with flexible and rigid PCBS;Lau;Journal of Engineering Science and Technology,2014

5. Effective Solder for Improved Thermo-Mechanical Reliability of Solder Joints in a Ball Grid Array (BGA) Soldered on Printed Circuit Board (PCB)

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