3D TSV processes and its assembly/packaging technology-Reference-Cited by-同舟云学术

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3D TSV processes and its assembly/packaging technology

Published:2009-09 Issue: Volume: Page:
ISSN:
Container-title:2009 IEEE International Conference on 3D System Integration
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Author:

Yoon Seung Wook,Yang Dae Wook,Koo Jae Hoon,Padmanathan Meenakshi,Carson Flynn

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/5290624/5306519/05306535.pdf?arnumber=5306535

Cited by 20 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Seizing the Bandwidth Scaling of On-Package Interconnect in a Post-Moore's Law World;Proceedings of the 37th International Conference on Supercomputing;2023-06-21

2. Parasitic effect analysis on TSV design factors;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

3. Design, Manufacture and Assembly of 3D Integrated Optical Transceiver Module Based on an Active Photonic Interposer;Processes;2022-11-10

4. Equivalent Modeling of Microbump Layer in Microsystem for Thermal Analysis Based on Differential Idea;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-09

5. Advanced 2.5D and 3D packaging technologies for next generation Silicon Photonics in high performance networking applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

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