Demonstration of Unified Memory in FinFETs

Author:

Chang Sung-Jae1,Bawedin Maryline2,Lee Jong-Hyun3,Lee Jung-Hee4,Cristoloveanu Sorin5

Affiliation:

1. Electrical Engineering, Yale University, 15 Prospect Street, New Haven, CT 06511, USA

2. Institut d'Electronique du Sud, Université Montpellier 2, 34095 Montpellier Cedex 5, France

3. School of Electrical Engineering, Kyungpook National University, 80 Daehak-ro, Buk-gu, Deagu, 702-201, Korea

4. School of Electrical Engineering, Kyungpook National University, 80 Daehak-ro, Buk-gu, Daegu, 702-201, Korea

5. Institute of Microelectronics, Electromagnetism and Photonics, Grenoble INP, 38016 Grenoble Cedex 1, France

Abstract

Floating-body-induced transient mechanism in advanced FinFETs was investigated for unified and multi-bit memory capability. Nonvolatile memory operation was achieved by modifying the SOI buried insulator (BOX) such as the SiO 2- Si 3 N 4- SiO 2 (ONO) BOX can accumulate permanent charges. Charges are injected/removed in the Si 3 N 4 layer by back-gate or drain bias and sensed remotely, by gate coupling, through the modulation of the drain current flowing at the front interface. On the other hand, the isolated silicon body of the transistor can store volatile charges, generated by impact ionization and able to modulate the drain current flowing at the back interface. Our experimental results successfully demonstrate that these two different memory modes can be advantageously combined for multi-bit volatile memory operation. The volatile memory behavior strongly depends on the distribution of the nonvolatile charges stored in the nitride buried layer. Our measurements manifest that the nonvolatile charges located near the drain terminal have larger influence on the volatile memory operation than the charges located at the opposite terminal. Also, we reveal that the bias conditions and device geometry are important factors for the two memory modes.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electronic, Optical and Magnetic Materials

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