Investigation of Gate Induced Drain Leakage in Nanotube and Nanowire: A Comprehensive Study

Abstract

In this paper, a comprehensive study of gate-induced drain leakage (GIDL) in conventional silicon-nanotube (Si-NT JLFET), SiGe Source/Drain silicon-nanotube junctionless field effect transistor (S/D Si-NT JLFET) and conventional nanowire (NW) have been performed using technology computer-aided design simulations. We have also demonstrated that inclusion of SiGe S/D in Si-NT JLFET reduced the OFF-state current by order of ~3 from NT JLFET and by order of ~6 from NW JLFET. The impact of variation of core gate thickness ([Formula: see text], germanium (Ge) content [Formula: see text], and location of SiGe in source and drain regions of the S/D Si-NT JLFET have been studied from the GIDL perspective. We found that SiGe S/D Si-NT JLFET exhibits impressively high [Formula: see text]/[Formula: see text] ratio [Formula: see text] with reduced lateral band-to-band tunneling (L-BTBT)-induced GIDL than the conventional nanowire device. The is due to SiGe S/D that creates a energy valence band discontinuity at source drain interfaces which limits the flow of electrons from channel to drain region in the OFF-state.