Author:
LAU JOHN,CHANG CHRIS,CHEN RAY
Publisher
World Scientific Pub Co Pte Lt
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Cited by
11 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Flip Chip Technology;Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology;2024
2. System-in-Package (SiP);Semiconductor Advanced Packaging;2021
3. Solder Joints in PCB Assembly and Semiconductor Packaging;Assembly and Reliability of Lead-Free Solder Joints;2020
4. Flip Chip Technology Versus FOWLP;Fan-Out Wafer-Level Packaging;2018
5. Recent Advances and New Trends in Flip Chip Technology;Journal of Electronic Packaging;2016-07-25