MANUFACTURING ANALYSIS OF UNDERFILL PROCESSING FOR LOW-COST FLIP CHIP ASSEMBLY-Reference-Cited by-同舟云学术

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MANUFACTURING ANALYSIS OF UNDERFILL PROCESSING FOR LOW-COST FLIP CHIP ASSEMBLY

Published:1998-03 Issue:01 Volume:08 Page:39-50
ISSN:0960-3131
Container-title:Journal of Electronics Manufacturing
language:en
Short-container-title:Journal of Electronics Manufacturing

Author:

BALDWIN DANIEL F.,PASCARELLA NATHAN W.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering

Link

http://www.worldscientific.com/doi/pdf/10.1142/S0960313198000045

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Rotational solder self-alignment mechanics modeling for a flip chip in the presence of a viscous fluid;Microelectronics Reliability;2016-10

2. Translation Solder Self-Alignment Mechanics Modeling for a Flip Chip in the Presence of a Viscous Fluid;Journal of Electronic Packaging;2010-12-01

3. Yield analysis and process modeling of low cost, high throughput flip chip assembly based on no-flow underfill materials;IEEE Transactions on Electronics Packaging Manufacturing;2001-04

4. Flip chip processing of lead-free solders and halogen-free high density microvia substrates;2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)

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