Flip chip processing of lead-free solders and halogen-free high density microvia substrates-Reference-Cited by-同舟云学术

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Flip chip processing of lead-free solders and halogen-free high density microvia substrates

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Container-title:2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070)
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Author:

Baynham G.,Baldwin D.F.,Boustedt K.,Johansson A.,Wennerholm C.,Patterson D.,Elenius P.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6887/18541/00853308.pdf?arnumber=853308

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board;Journal of Electronic Packaging;2002-05-02

2. Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board;IEEE Transactions on Electronics Packaging Manufacturing;2002-01

3. Reliability of wafer level chip scale package (WLCSP) with 96.5Sn-3.5Ag lead-free solder joints on build-up microvia printed circuit board;International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

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