TESTING METHOD FOR MEASURING IMPACT STRENGTH OF BGA SOLDER JOINTS ON ELECTRONIC PACKAGE-Reference-Cited by-同舟云学术

TESTING METHOD FOR MEASURING IMPACT STRENGTH OF BGA SOLDER JOINTS ON ELECTRONIC PACKAGE

Published:2008-04-30 Issue:09n11 Volume:22 Page:1050-1055
ISSN:0217-9792
Container-title:International Journal of Modern Physics B
language:en
Short-container-title:Int. J. Mod. Phys. B

Author:

ADACHI TADAHARU¹,GOTO HIROTAKA²,ARAKI WAKAKO¹,OMORI TAKAHIRO³,KAWAMURA NORIYASU⁴,MUKAI MINORU³,KAWAKAMI TAKASHI³

Affiliation:

1. Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology, 2-12-1 Ookayama, Meguro-ku, Tokyo 1528552, Japan

2. Enterprise Solution Division, NTT Comware Corporation, 1-6 Nakase, Mihama-ku, Chiba, 2610023, Chiba, Japan

3. Mechanical Systems Laboratory, Corporate Research & Development Center, Toshiba Corporation, 1, Komukai Toshiba-cho, Saiwai-ku, Kawasaki, 2128582, Japan

4. PC Development Center, Toshiba Corporation Parsonal Computer & Network Company, 2-9,Suehiro-cho, Ome, Tokyo, 1988710, Japan

Abstract

A pendulum-impact testing machine was developed to measure the impact strength of ball-grid-array (BGA) solder joints between an electronic package and a circuit board. Ball solders were connected to daisy-chain between a dummy electronic package and a circuit board. The upper side of the package was directly bonded to a load cell. The rear side of the circuit board was also bonded to an aluminum alloy block fixed on a base. A pendulum made of aluminum alloy was collided into the load cell to apply tensile impact to the solder joints through the load cell. The history of the impact load could be controlled by raising the angle of the pendulum. The fracture of a BGA solder joint was detected by measuring the resistance of the daisy-chain circuit on the board. Therefore, the impact strengths of the solder joints at electrical disconnection and mechanical breaking of all joints could be determined. The experimental results showed that this method is useful for measuring the impact strength of BGA solder joints.

Publisher

World Scientific Pub Co Pte Lt

Subject

Condensed Matter Physics,Statistical and Nonlinear Physics

Link

https://www.worldscientific.com/doi/pdf/10.1142/S021797920804630X

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