Author:
Tamulevičius Tomas,Šimatonis Linas,Ulčinas Orestas,Tamulevičius Sigitas,Žukauskas Egidijus,Rekuvienė Regina,Mažeika Liudas
Funder
Kaunas University of Technology
Publisher
Oxford University Press (OUP)
Subject
Radiology Nuclear Medicine and imaging,Instrumentation,Structural Biology
Reference32 articles.
1. Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor;Kyungyoung;NDT E Int.,2002
2. Phommahaxay A , Wolf J , Hoffrogge P , Brand S , Czurratis P , Philipsen H , Civale Y , Vandersmissen K , Halder S , Beyer G , Swinnen B , Miller A , Beyne E (2013) High frequency scanning acoustic microscopy applied to 3D integrated process: void detection in through silicon vias. In: Electronic Components & Technology Conference, USA, Las Vegas 227–231. doi: 10.1109/ECTC.2013.6575576 .
3. Maev R (2008) Acoustic microscopy. In: Fundamentals and Applications, (Wiley-VCH Verlag GmbH & Co, Canada).
4. Ramanathan S , Semmens J E , Kessler L W (2006) High-frequency acoustic microscopy studies of buried interfaces in silicon. In: Electronic Components & Technology Conference, USA, San Diego 1865–1868. doi:10.1109/ECTC.2006.1645914.
5. David J , Cheeke N (2012) Fundamentals and Applications of Ultrasonic Waves, (Taylor & Francis Group, USA, Florida. ISBN 978-1-4398-5494
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献