High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias-Reference-Cited by-同舟云学术

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High frequency scanning acoustic microscopy applied to 3D integrated process: Void detection in Through Silicon Vias

Published:2013-05 Issue: Volume: Page:
ISSN:
Container-title:2013 IEEE 63rd Electronic Components and Technology Conference
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Author:

Phommahaxay Alain,De Wolf Ingrid,Hoffrogge Peter,Brand Sebastian,Czurratis Peter,Philipsen Harold,Civale Yann,Vandersmissen Kevin,Halder Sandip,Beyer Gerald,Swinnen Bart,Miller Andy,Beyne Eric

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/6573226/6575533/06575576.pdf?arnumber=6575576

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Detection and Classification of Typical Defects in TSV and RDL;2019 20th International Conference on Electronic Packaging Technology(ICEPT);2019-08

2. Optically Detecting Acoustic Oscillations at the Nanoscale: Exploring Techniques Suitable for Studying Elastic Wave Propagation;IEEE Nanotechnology Magazine;2019-06

3. Novel technology for microlenses for imaging applications;Applied Optics;2018-10-25

4. Machine-Learning Approach in Detection and Classification for Defects in TSV-Based 3-D IC;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-04

5. Defect analysis using scanning acoustic microscopy for bonded microelectronic components with extended resolution and defect sensitivity;Microsystem Technologies;2017-08-29

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