Affiliation:
1. National Institute of Advanced Industrial Science and Technology
2. Toshiba Corporation
Abstract
The SiC trench gate MOSFET with narrow cell pitch is demonstrated using a process in which the n+ source is self-aligned to the trench gate. A minimum cell pitch of 1.6 μm, which is difficult to achieve using the conventional device structure, is easily fabricated by applying a deep n+ source and a buried interlayer dielectric structure. The cell pitch reduction indicates a beneficial trend that contributes to a decrease in the specific on-resistance and an increase in the breakdown voltage. The process and structure are promising for further improving SiC power device characteristics.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science