Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

Abstract

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.