Affiliation:
1. Cree, Incorporation
2. INTRINSIC Semiconductor Corp.
3. Sterling Semiconductor, Inc
Abstract
The move towards commercialization of SiC based devices places increasing demands on the
quality of the substrate material. While the industry has steadily decreased the micropipe (MP) levels in
commercial SiC substrates over the past years, the achievement of wafers that are entirely free of MPs
marks an important milestone in commercialization of SiC based devices. We present the results of a
study for controlling the nucleation and propagation of MP defects in SiC ingots grown via PVT. Our
studies confirm that during bulk growth of SiC, foreign polytype nucleation such as 3C-polytype occurs
at the initial stages of growth (nucleation period) and/or during subsequent growth in the presence of
facets. Results in this investigation suggest that polytype instability during crystal growth adversely
impacts the MP density. Based on this key concept, growth conditions for nucleation and growth stages
were optimized. These conditions were subsequently implemented in an innovative PVT growth
environment to achieve a growth technique with highly effective polytype control. Under continuously
modulated growth conditions, MPs induced by seed material and/or formed during the growth were
eliminated. 2-inch and 3-inch diameter MP-free (zero MP density) conducting 4H-SiC ingots were
obtained.
Publisher
Trans Tech Publications, Ltd.
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Cited by
29 articles.
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