Temperature Distribution of IFA Polishing Single Silicon Wafer

Abstract

The ice fixed abrasives (IFA) polishing is a potential polishing process in the semiconductor industry to realize superior surface finish and planarity for semiconductor wafers. The key question in IFA polishing is how to keep suitable ambient temperature and melting rate in production process in order to avoid premature failure of the IFA pad. In this paper, effects of ambient temperature (T), pressure in cylinder (Pc), rotary speed of IFA pad (v) and eccentricity of pressure head (e) on temperature distribution and melting rate of the IFA pad are researched. The results show that T should be kept at about 10 °C in order to control the melting rate of the IFA pad effectively and keep longer polishing time. And suitable Pc, e can be kept at 0.075 MPa or 0.1 MPa and 20 mm or 30 mm, respectively. In order to increase IFA polishing efficiency, the rotary speed of IFA pad can be increased appropriately. All the results provide the basis for choosing suitable processing parameters in IFA polishing.