100 mm 4HN-SiC Wafers with Zero Micropipe Density

Author:

Leonard R.T.1,Khlebnikov Y.1,Powell Adrian R.1,Basceri C.2,Brady M.F.1,Khlebnikov I.3,Jenny Jason R.4,Malta D.P.4,Paisley Michael J.4,Tsvetkov Valeri F.4,Zilli R.4,Deyneka E.4,Hobgood H.McD.4,Balakrishna Vijay4,Carter Jr. Calvin H.4

Affiliation:

1. Cree Research, Inc.

2. Cree, Incorporation

3. INTRINSIC Semiconductor Corp.

4. Cree Incorporation

Abstract

Recent advances in PVT c-axis growth process have shown a path for eliminating micropipes in 4HN-SiC, leading to the demonstration of zero micropipe density 100 mm 4HN-SiC wafers. Combined techniques of KOH etching and cross-polarizer inspections were used to confirm the absence of micropipes. Crystal growth studies for 3-inch material with similar processes have demonstrated a 1c screw dislocation median density of 175 cm-2, compared to typical densities of 2x103 to 4x103 cm-2 in current production wafers. These values were obtained through optical scanning analyzer methods and verified by x-ray topography.

Publisher

Trans Tech Publications, Ltd.

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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