Etching of Silicon Dioxide with Gas Phase HF and Water: Initiation, Bulk Etching, and Termination.
Author:
Affiliation:
1. Intel Corporation
2. University of Arizona
Publisher
Trans Tech Publications, Ltd.
Subject
Condensed Matter Physics,General Materials Science,Atomic and Molecular Physics, and Optics
Link
https://www.scientific.net/SSP.134.3.pdf
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5. Kern, W., Handbook of semiconductor wafer cleaning technology: science, technology, and applications. Materials science and process technology series. Electronic materials and process technology. 1993, Park Ridge, N.J., U.S.A.: Noyes Publications. 623 p.
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