The Temperature Field Analysis about the Thermal Assembly Process of the Roller Sleeve of HFCG160 Roller Press

Author:

Bao Jia Han1,Wang Yong1,Cai Jie1

Affiliation:

1. Anhui University of Technology

Abstract

This paper used the finite element software ANSYS to simulate the thermal assembly process of the roller sleeve of the HFCG160 roller press, and study the change of the temperature field. And then, comparing the simulation temperature with the test temperature, the results show that the simulation temperature is basically consistent with the test temperature, while there are slight biases on the individual points within a certain period of time. The main reason for biases between the simulation temperature and the test temperature is that the convective heat transfer coefficient is average during the simulation, which ignoring the convective heat transfer coefficient decreases with the decreasing of temperature.

Publisher

Trans Tech Publications, Ltd.

Reference8 articles.

1. W. Bao, X.M. Wang and Y.L. Zhang: China Cement. Journal Vol. (2003), p.49.

2. Q.S. Yang: Advanced heat transfer (Shanghai Jiao-tong University Press, China 1996).

3. D.M. Trujillo, C.G. Pappoff: Finite Elem. Anal. Des. Journal Vol. 38 (2002), p.263.

4. B. Vermeersch, G.D. Mey: Microelectron. Reliab. Journal Vol. 48 (2008), p.734.

5. C.L. Yeh, Y.F. Chen, C.Y. Wen: Exp. Therm. Fluid Sci. Journal Vol. 27 (2003), p.271.

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