Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. Conduction of heat in solids;Carslaw,1959
2. Eigenfunction expansion versus the boundary element method for thermal problems in microelectronics;Rottiers;J Comput Appl Math,1987
3. Hot spot effects in hybrid circuits;Rottiers;IEEE Trans Comp Hybr Manuf Technol,1988
4. Experimental verification of the temperature distribution on ceramic substrates;Kos;J Phys D Appl Phys,1994
5. Lee S, Van Au SS, Moran KP. Constriction/spreading resistance model for electronics packaging. In: Proceedings of the ASME/JSME thermal engineering conference, vol. 4; 1995. p. 199–206.
Cited by
15 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献