Abstract
In relation to power converter design, power density is increasing while the form factor isdecreasing. This trend generally reduces the rate of the cooling process, which increases the mutualthermal coupling among the surrounding power components. Most of the traditional modelsusually ignore the mutual effects or just focus on the conduction coupling. To deal with these factors,the thermal modeling for a boost converter system has been built to compare the junctiontemperatures (Tj) and the increments under different working conditions in order to consider theconduction coupling. A multi-variable thermal resistances model is proposed in this paper toincorporate the convection thermal coupling into the mutual thermal effects. The couplingresistances, MOSFET to the diode[...]
Funder
National Natural Science Foundation of China
Subject
Fluid Flow and Transfer Processes,Computer Science Applications,Process Chemistry and Technology,General Engineering,Instrumentation,General Materials Science
Cited by
3 articles.
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